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    Apollo510 keyvisual bg mobile
    Apollo510 keyvisual bg desktopApollo330 Plus Series keyvisual front desktop

    Apollo330 Plus SoC Series

    AI Blooming At the Edge

    Apollo330 Plus Series keyvisual front Mobile

    The Apollo330 Plus SoC Series enables customers to design smarter, more capable devices with industry-leading power efficiency. This ultra-low power platform delivers enhanced memory performance, multiple package and connectivity options, as well as a rich set of peripherals for conventional edge and AI applications. Built on an Arm® Cortex®-M55 core with Helium™ DSP acceleration, it supports always-on, real-time AI inferencing across three variants — Apollo330, Apollo330B, and Apollo330M Plus — serving healthcare, industrial edge, wearable, hearable, and smart home applications.

    Apollo330M Plus
    Apollo330M Plus
    Apollo330B Plus
    Apollo330B Plus
    Apollo330 Plus
    Apollo330 Plus
    Where to Buy
    Design Resources

    Real-Time Edge AI Inferencing

    01

    Multi-Protocol Connectivity

    The Apollo330B Plus supports Bluetooth® Low Energy 5.4, while the Apollo330M Plus adds multi-protocol support for Dual Mode Bluetooth, IEEE 802.15.4, Thread, and Matter.

    02

    Powerful Edge Processing

    Up to 250 MHz Arm Cortex-M55 application processor with turboSPOT® and Helium™ technology for high-performing AI at the edge

    03

    Always-on and Real-Time AI

    Enable always-on, real-time AI directly on the device to enhance security, boost robustness, and reduce energy use.

    04

    Ultra-low Power

    Ultra-low active and sleep power, enabled by Ambiq’s Subthreshold Power Optimized Technology (SPOT®) platform, helps edge devices maximize their battery life.

    Block Diagram Apollo330 Plus Series

    Ambiq Apollo330B Plus diagram

    Comparison Table

    Select chips from the comparison list in the table and find the perfect option for you

    Select products

    Select chips from the comparison list in the table and find the perfect option for you

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    Apollo330 Plus Series

    Parameters

    SoC Frequency

    SoC

    SoC CoreMark®Power Efficiency

    NVM

    SRAM

    Voltage

    ADC

    UART

    I/O

    MSPI Master

    I²S

    Audio

    Display

    Graphics

    Security

    Connectivity

    RF Sensitivity

    Tx Output Power

    Packages

    Ordering Information

    Apollo330M Plus

    Apollo330M Plus

    96 MHz
    250 MHz turboSPOT

    32-bit Arm Cortex-M55 with Helium™ technology,
    Network coprocessor, DMA

    Contact Ambiq

    2MB

    2MB

    1.71-3.63V

    12-bit, 11-channel, up to 2.8 MS/s Sampling Rate ADC

    2

    I2C/SPI masters (6x)
    1x full-duplex I²C/SPI Slave
    USB 2.0 FS/HS
    SDIO (v3.0) / eMMC (2x)

    1/2/4-bit wide (2x) up to 96 MT/s (SDR/DDR)
    1/2/4/8/16-bit wide (1x) up to 250 MT/s (SDR/DDR)

    I²S Master/Slave full-duplex (1x)

    PDM stereo DMIC interface (1x)
    PLL for Precision Audio

    –

    –

    secureSPOT® 3.0
    Arm TrustZone® Security

    Bluetooth Low Energy 5.4, Bluetooth Classic, 802.15.4, Thread, and Matter

    -95/-98/-104dBm (2Mbps/1Mbps/125kbps)

    Up to +13dBm

    5.3 x 5.3 mm, BGA with 120 GPIO
    4.0 x 4.0 mm, CSP with 68 GPIO  

    • AP330MPA-CCR (CSP) • AP330MPA-IBR (BGA)

    Apollo330B Plus

    Apollo330B Plus

    96 MHz
    250 MHz turboSPOT

    32-bit Arm Cortex-M55 with Helium™ technology,
    Network coprocessor, DMA

    Contact Ambiq

    2MB

    2MB

    1.71-3.63V

    12-bit, 11 channels, up to 1.7 MS/s Sampling Rate ADC

    2

    I2C/SPI masters (6x)
    1x full-duplex I²C/SPI Slave
    USB 2.0 FS/HS
    SDIO (v3.0) / eMMC (2x)

    1/2/4-bit wide (2x) up to 96 MT/s (SDR/DDR)
    1/2/4/8/16-bit wide (1x) up to 250 MT/s (SDR/DDR)

    I²S Master/Slave full-duplex (1x)

    PDM stereo DMIC interface (1x)
    PLL for Precision Audio

    –

    –

    secureSPOT® 3.0
    Arm TrustZone® Security

    Bluetooth Low Energy 5.4

    -95/-98/-104dBm
    (2Mbps/1Mbps/125kbps)

    Up to +13dBm

    5.3 x 5.3 mm, BGA with 120 GPIO
    4.0 x 4.0 mm, CSP with 68 GPIO  

    • AP330BPA-CCR (CSP)
    • AP330BPA-ICR (CSP)

    Property 1Apollo 3 blue plus

    Apollo3 Blue Plus

    48 MHz, 96 MHz turboSPOT

    32-bit Arm Cortex-M4F, DMA, Arm Cortex-M0 for Bluetooth Low Energy

    33 µW/MHz

    2MB

    768KB

    1.755-3.63 V

    14-bit, 15-channel, up to 2.67 MS/s Sampling Rate ADC

    2

    I²C/SPI Master (6x)

    1/2/4/8-bit wide (3x) up to 48 MT/s (SDR) ISO7816 Master

    I²S Slave for PDM, Audio Pass-through

    PDM stereo DMIC interface (1x)

    SPI 3-wire/4-wire, Dual/QuadSPI

    –

    secureSPOT w/ Secure Boot

    Bluetooth Low Energy 5

    -93 dBm

    Up to +3 dBm

    • 5.3 x 4.3 x 0.8 mm, BGA-108 w/ 74 GPIO

    • AMA3B2KK-KBR (BGA)
    • AMA3B2EVB (EVB)

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    Apollo330 Plus Series Evaluation Board

    Apollo330 Plus Series Arm® Cortex®-M55 based SoC in the BGA package (AP330MPA-CBR)

    USB Type C connector for power/download/debug (J16)

    USB Type C connector for power/data to Apollo330M Plus SoC (J18)

    On-board Segger J-Link debugger

    Debug-in port (J2) (SWD or ETM)

    Three user-controlled LEDs

    Two push buttons for application use, plus a reset push button

    Power slide switch with LED power indicator

    On-board interfaces:
    – SDIO 8 GB eMMC (ISSI IS21EF08G-JCLI)
    – High-speed expansion connector
    – MikroBUS socket interface (3.3V or 1.8V interface)

    General purpose male headers (J8 and J13) for I/O and power access to a shield board

    High-speed connector (J7 – QSH-060-01-X-D-A) for interfacing to add-on cards

    RF switch/connector (Murata MM8430-2610RA1) for BLE PHY testing

    Test points for voltage measurements and jumpers for current measurements

    Solder bridge options for power supply flexibility and peripheral access options

    RoHS compliant

    AP330MPEVB Apollo330 Plus EVB Layout 1600x800 1
    AP330MPEVB Apollo330 Plus EVB StraightAngle 1600x800 1
    AP330MPEVB Apollo330 Plus EVB RightAngle 1600x800 1
    AP330MPEVB Apollo330 Plus EVB LeftAngle 1600x800 1
    AP330MPEVB Apollo330 Plus EVB Layout 1600x800 1
    AP330MPEVB Apollo330 Plus EVB StraightAngle 1600x800 1
    AP330MPEVB Apollo330 Plus EVB RightAngle 1600x800 1
    AP330MPEVB Apollo330 Plus EVB LeftAngle 1600x800 1
    AP330MPEVB Apollo330 Plus EVB Layout 1600x800 1
    AP330MPEVB Apollo330 Plus EVB StraightAngle 1600x800 1
    AP330MPEVB Apollo330 Plus EVB RightAngle 1600x800 1
    AP330MPEVB Apollo330 Plus EVB LeftAngle 1600x800 1

    Where to Buy

    csp
    AP330NPA CCR Apollo330 PLUS CSP 276x276 1

    AP330NPA-CCR

    Apollo330 Plus
    csp
    AP330BPA CCR Apollo330B Plus CSP 276x276 1

    AP330BPA-CCR

    Apollo330B Plus
    csp
    AP330MPA CCR Apollo330M Plus CSP 276x276 1

    AP330MPA-CCR

    Apollo330M Plus
    AP330MPEVB Apollo330 Plus EVB Front NoBoarder S

    AP330MPEVB

    Apollo330 Plus Series Evaluation Board

    Design Resources

    Additional Documentation

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    Frequently Asked Questions (FAQ)

    • The Apollo330 Plus SoC Series is Ambiq’s ultra-low-power platform for real-time edge AI, combining enhanced memory performance, multiple package and connectivity options, and a rich peripheral set for conventional edge and AI applications. 

    • An Arm® Cortex®-M55 core with Helium™ vector DSP extensions, giving the series dedicated acceleration for real-time, always-on AI inferencing. 

    • Three variants: Apollo330 Plus, Apollo330B Plus, and Apollo330M Plus, each available in different ordering configurations to match specific connectivity and package needs. 

    • A 5.3mm x 5.3mm BGA package with 120 GPIO, and a 4.0mm x 4.0mm CSP package with 68 GPIO. 

    • Multi-protocol wireless connectivity positions the series for connected edge AI applications that need flexible radio support alongside on-device inferencing. The Apollo330B Plus SoC features a Bluetooth® Low Energy 5.4 radio, while the Apollo330M Plus SoC supports Dual-Mode Bluetooth (Bluetooth Classic and Bluetooth Low Energy 5.4). Additionally, both the Apollo330B Plus and Apollo330M Plus support LE Audio. The Apollo330M Plus will also feature Matter and Thread connectivity via an OTA update. 

    • Healthcare, industrial edge, smart remotes, smart home and buildings, smartcards, wearables, gaming, and hearables. 

    • Yes — the Apollo330 Plus Series Evaluation Board (AP330MPEVB) is available for prototyping and development. 

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