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Apollo330 Plus SoC Series

AI Blooming At the Edge

Apollo330 Plus Series keyvisual front Mobile

Apollo330 Plus SoC Series使客户能够设计出更智能、功能更强大的设备,并具备业界领先的能效。这一超低功耗平台不仅提供了增强的内存性能、多种封装和连接选项,还为传统边缘计算和AI应用提供了丰富的外设功能。

Apollo330M Plus
Apollo330M Plus
Apollo330B Plus
Apollo330B Plus
Apollo330 Plus
Apollo330 Plus

Real-Time Edge AI Inferencing

01

Multi-Protocol Connectivity

Apollo330B Plus 支持 Bluetooth® Low Energy 5.4 标准,而 Apollo330M Plus 则额外支持双模蓝牙、IEEE 802.15.4、Thread 和 Matter 等多协议。

02

Powerful Edge Processing

最高支持 250 MHz 的 Arm Cortex-M55 应用处理器,搭载 turboSPOT® 和 Helium™ 技术,可在边缘实现高性能 AI

03

Always-on and Real-Time AI

直接在设备上启用始终在线的实时AI,以增强安全性、提高鲁棒性并降低能耗。

04

Ultra-low Power

得益于Ambiq的亚阈值功耗优化技术(SPOT®)平台,其超低的活动模式和睡眠模式功耗有助于边缘设备最大限度地延长电池续航时间。

Block Diagram for the Ultra-Low Power Apollo330 Plus Series

Ambiq Apollo330B Plus diagram

Comparison Table

Select chips from the comparison list in the table and find the perfect option for you

参数

SoC Frequency

SoC

SoC CoreMark®Power Efficiency

NVM

SRAM

Voltage

ADC

UART

I/O

MSPI Master

I²S

Audio

Display

Graphics

Security

Connectivity

RF Sensitivity

Tx Output Power

Packages

Ordering Information

Apollo330M Plus

Apollo330M Plus

96 MHz
250 MHz turboSPOT

32-bit Arm Cortex-M55 with Helium™ technology,
Network coprocessor, DMA

Contact Ambiq

2MB

2MB

1.71-3.63V

12-bit, 11-channel, up to 2.8 MS/s Sampling Rate ADC

2

I2C/SPI masters (6x)
1x full-duplex I²C/SPI Slave
USB 2.0 FS/HS
SDIO (v3.0) / eMMC (2x)

1/2/4-bit wide (2x) up to 96 MT/s (SDR/DDR)
1/2/4/8/16-bit wide (1x) up to 250 MT/s (SDR/DDR)

I²S Master/Slave full-duplex (1x)

PDM stereo DMIC interface (1x)
PLL for Precision Audio

-

-

secureSPOT® 3.0
Arm TrustZone® Security

Bluetooth Low Energy 5.4, Bluetooth Classic, 802.15.4, Thread, and Matter

-95/-98/-104dBm (2Mbps/1Mbps/125kbps)

Up to +13dBm

5.3 x 5.3 mm, BGA with 120 GPIO
4.0 x 4.0 mm, CSP with 68 GPIO  

• AP330MPA-CCR (CSP) • AP330MPA-IBR (BGA)

Apollo330B Plus

Apollo330B Plus

96 MHz
250 MHz turboSPOT

32-bit Arm Cortex-M55 with Helium™ technology,
Network coprocessor, DMA

Contact Ambiq

2MB

2MB

1.71-3.63V

12-bit, 11 channels, up to 1.7 MS/s Sampling Rate ADC

2

I2C/SPI masters (6x)
1x full-duplex I²C/SPI Slave
USB 2.0 FS/HS
SDIO (v3.0) / eMMC (2x)

1/2/4-bit wide (2x) up to 96 MT/s (SDR/DDR)
1/2/4/8/16-bit wide (1x) up to 250 MT/s (SDR/DDR)

I²S Master/Slave full-duplex (1x)

PDM stereo DMIC interface (1x)
PLL for Precision Audio

-

-

secureSPOT® 3.0
Arm TrustZone® Security

Bluetooth Low Energy 5.4

-95/-98/-104dBm
(2Mbps/1Mbps/125kbps)

Up to +13dBm

5.3 x 5.3 mm, BGA with 120 GPIO
4.0 x 4.0 mm, CSP with 68 GPIO  

• AP330BPA-CCR (CSP)
• AP330BPA-ICR (CSP)

Property 1Apollo 3 blue plus

Apollo3 Blue Plus

48 MHz, 96 MHz turboSPOT

32-bit Arm Cortex-M4F, DMA, Arm Cortex-M0 for Bluetooth Low Energy

33 µW/MHz

2MB

768KB

1.755-3.63 V

14-bit, 15-channel, up to 2.67 MS/s Sampling Rate ADC

2

I²C/SPI Master (6x)

1/2/4/8-bit wide (3x) up to 48 MT/s (SDR) ISO7816 Master

I²S Slave for PDM, Audio Pass-through

PDM stereo DMIC interface (1x)

SPI 3-wire/4-wire, Dual/QuadSPI

-

secureSPOT w/ Secure Boot

Bluetooth Low Energy 5

-93 dBm

Up to +3 dBm

• 5.3 x 4.3 x 0.8 mm, BGA-108 w/ 74 GPIO

• AMA3B2KK-KBR (BGA)
• AMA3B2EVB (EVB)

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