The Apollo330 Plus Series enable customers to design smarter, more capable devices with industry-leading power efficiency. This ultra-low power platform delivers enhanced memory performance, multiple package and connectivity options, as well as a rich set of peripherals for conventional edge and AI applications.
Select chips from the comparison list in the table and find the perfect option for you
Select chips from the comparison list in the table and find the perfect option for you
SoC Frequency
SoC
SoC CoreMark®Power Efficiency
NVM
SRAM
Voltage
ADC
UART
I/O
MSPI Master
I²S
Audio
Display
Graphics
Security
Connectivity
RF Sensitivity
Tx Output Power
Packages
Ordering Information
Apollo330M Plus
96 MHz
250 MHz turboSPOT
32-bit Arm Cortex-M55 with Helium™ technology, Network coprocessor, DMA
Contact Ambiq
2MB
2MB
1.71-3.63V
12-bit, 11-channel, up to 2.8 MS/s Sampling Rate ADC
2
I2C/SPI masters (6x) 1x full-duplex I²C/SPI Slave USB 2.0 FS/HS SDIO (v3.0) / eMMC (2x)
1/2/4-bit wide (2x) up to 96 MT/s (SDR/DDR) 1/2/4/8/16-bit wide (1x) up to 250 MT/s (SDR/DDR)
I²S Master/Slave full-duplex (1x)
PDM stereo DMIC interface (1x) PLL for Precision Audio
-
-
secureSPOT® 3.0 Arm TrustZone® Security
Bluetooth Low Energy 5.4
802.15.4, Thread, and Matter
-95/-98/-104dBm (2Mbps/1Mbps/125kbps)
Up to +14dBm
BGA CSP (est. 4 x 4 mm)
• AP330MPA-CCR (CSP) • AP330MPA-IBR (BGA)
Apollo330B Plus
96 MHz 250 MHz turboSPOT
32-bit Arm Cortex-M55 with Helium™ technology, Network coprocessor, DMA
Contact Ambiq
2MB
2MB
1.71-3.63V
12-bit, 11 channels, up to 1.7 MS/s Sampling Rate ADC
2
I2C/SPI masters (6x) 1x full-duplex I²C/SPI Slave USB 2.0 FS/HS SDIO (v3.0) / eMMC (2x)
1/2/4-bit wide (2x) up to 96 MT/s (SDR/DDR) 1/2/4/8/16-bit wide (1x) up to 250 MT/s (SDR/DDR)
I²S Master/Slave full-duplex (1x)
PDM stereo DMIC interface (1x) PLL for Precision Audio
-
-
secureSPOT® 3.0 Arm TrustZone® Security
Bluetooth Low Energy 5.4
-95/-98/-104dBm (2Mbps/1Mbps/125kbps)
Up to +14dBm
BGA CSP (est. 4 x 4 mm)
• AP330BPA-CCR (CSP) • AP330BPA-ICR (CSP)
Apollo330 Plus
96 MHz
250 MHz turboSPOT
32-bit Arm Cortex-M55 with Helium™ technology, DMA
Contact Ambiq
2MB
2MB
1.71-3.63V
12-bit, 11 channels, up to 1.7 MS/s Sampling Rate ADC
2
I2C/SPI masters (6x) 1x full-duplex I²C/SPI Slave USB 2.0 FS/HS SDIO (v3.0) / eMMC (2x)
1/2/4-bit wide (2x) up to 96 MT/s (SDR/DDR) 1/2/4/8/16-bit wide (1x) up to 250 MT/s (SDR/DDR)
I²S Master/Slave full-duplex (1x)
PDM stereo DMIC interface (1x) PLL for Precision Audio
-
-
secureSPOT® 3.0 Arm TrustZone® Security
-
-
-
BGA CSP (est. 4 x 4 mm)
• AP330NPA-CCR (CSP)
• AP330NPA-IBR (BGA)
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