Apollo330 Plus SoC Series

96 MHz
250 MHz turboSPOT

采用 Helium™ 技术的 32 位 Arm Cortex-M55、
网络协处理器、DMA

联系 Ambiq

2MB

2MB

1.71-3.63V

12 位、11 通道、高达 2.8 MS/s 采样率 ADC

2

I2C/SPI 主设备 (6x)
1x 全双工 I²C/SPI 从设备
USB 2.0 FS/HS
SDIO (v3.0) / eMMC (2x)

1/2/4 位宽 (2x) 最高 96 MT/秒 (SDR/DDR)
1/2/4/8/16 位宽 (1x) 最高 250 MT/秒 (SDR/DDR)

I²S 主/从全双工（1x）

PDM 立体声 DMIC 接口（1 个）
用于精密音频的 PLL

-

-

secureSPOT® 3.0
Arm TrustZone® 安全性

Bluetooth Low Energy 5.4
802.15.4、Thread 和 Matter

-95/-98/-104dBm (2Mbps/1Mbps/125kbps)

高达 +14dBm

5.3 x 5.3 毫米，BGA，带 120 个 GPIO
4.0 x 4.0 毫米，CSP，带 68 个 GPIO

- AP330MPA-CCR (CSP) - AP330MPA-IBR (BGA)

96 MHz
250 MHz turboSPOT

32-bit Arm Cortex-M55 with Helium™ technology,
Network coprocessor, DMA

Contact Ambiq

2MB

2MB

1.71-3.63V

12-bit, 11 channels, up to 1.7 MS/s Sampling Rate ADC

2

I2C/SPI masters (6x)
1x full-duplex I²C/SPI Slave
USB 2.0 FS/HS
SDIO (v3.0) / eMMC (2x)

1/2/4-bit wide (2x) up to 96 MT/s (SDR/DDR)
1/2/4/8/16-bit wide (1x) up to 250 MT/s (SDR/DDR)

I²S Master/Slave full-duplex (1x)

PDM stereo DMIC interface (1x)
PLL for Precision Audio

-

-

secureSPOT® 3.0
Arm TrustZone® Security

Bluetooth Low Energy 5.4

-95/-98/-104dBm
(2Mbps/1Mbps/125kbps)

Up to +14dBm

5.3 x 5.3 mm, BGA with 120 GPIO
4.0 x 4.0 mm, CSP with 68 GPIO  

• AP330BPA-CCR (CSP)
• AP330BPA-ICR (CSP)

96 MHz
250 MHz turboSPOT

32-bit Arm Cortex-M55 with Helium™ technology, DMA

Contact Ambiq

2MB

2MB

1.71-3.63V

12-bit, 11 channels, up to 1.7 MS/s Sampling Rate ADC

2

I2C/SPI masters (6x)
1x full-duplex I²C/SPI Slave
USB 2.0 FS/HS
SDIO (v3.0) / eMMC (2x)

1/2/4-bit wide (2x) up to 96 MT/s (SDR/DDR)
1/2/4/8/16-bit wide (1x) up to 250 MT/s (SDR/DDR)

I²S Master/Slave full-duplex (1x)

PDM stereo DMIC interface (1x)
PLL for Precision Audio

-

-

secureSPOT® 3.0
Arm TrustZone® Security

-

-

-

5.3 x 5.3 mm, BGA with 120 GPIO
4.0 x 4.0 mm, CSP with 68 GPIO  

• AP330NPA-CCR (CSP)
• AP330NPA-IBR (BGA)